We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Ashing device.
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Ashing device Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Ashing device Product List

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Yamato Material Co., Ltd. Business Introduction

Yamato Material Co., Ltd. Business Introduction

A business that considers the global environment based on consumer trends! Emphasizing planning, development, and proposal capabilities!

Yamato Material Co., Ltd. is a specialized trading company primarily engaged in the fields of "containers and packaging," "production systems," and "electronics-related products." The New Materials Division conducts planning and sales from inspection and packaging to production equipment in the semiconductor and electronics fields. 【Business Overview】 ■ New Materials Division *For more details, please refer to the catalog or feel free to contact us.*

  • Wafer

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Assing device

Assing device

It is a versatile and compact device that enables etching, ashing, and ion cleaning!

The "Ashing Device" is a mass production equipment capable of fully automated continuous processing of substrates up to a maximum of 12 inches in diameter. It is a versatile device that enables etching, ashing, and ion cleaning by switching gas types and plasma modes. 【Features】 ■ Switchable between RIE mode and DP mode ■ Reduced metal contamination through special surface treatment ■ Compact footprint ■ Independent application of two frequencies ■ Ultra-low temperature cooling stage Multi-chamber specifications, as well as custom designs for square substrates, can also be manufactured. *Please also refer to the PDF materials. *Feel free to contact us.

  • Etching Equipment
  • Ashing device

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UV ozone assaying device

UV ozone assaying device

Dry cleaning device that can expect synergistic effects from each element: UV irradiation, high-concentration ozone, and temperature heating! Low running costs and economical!

This is a dry cleaning device that is expected to have a synergistic effect from UV irradiation, high-concentration ozone, and temperature heating. The UV lamp is economical due to its long lifespan and low cost, resulting in low running costs. 【Features】 - A dry cleaning device that is expected to have a synergistic effect from UV irradiation, high-concentration ozone, and temperature heating - The UV lamp is economical due to its long lifespan and low cost, resulting in low running costs - Ozone concentration control is possible - Substrate heating with an IR heater improves cleaning reaction efficiency *For more details, please request materials or view the PDF data from the download section.

  • Other machine tools

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Batch type SWP assembling device

Batch type SWP assembling device

Damage-free, high rate, large area compatible, complete removal of ion damage, achieving complete radical processing. High-performance plasma ashing device.

High-density plasma generated by surface wave excited plasma is completely shielded from ions using an ion shielding trap. Only radicals are supplied to the substrate. Achieves damage-free ashing equivalent to wet processes with high-density radicals. Balances high rate and damage-free ashing. Compact batch type suitable for small substrates, compound semiconductors, and MEMS devices. Demonstrates excellent effectiveness in removing organic film sacrificial layers in MEMS manufacturing processes. An essential resist ashing device for high-end MEMS devices.

  • Ashing device

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Coaxial barrel-type assaying device

Coaxial barrel-type assaying device

Coaxial barrel-type plasma device

In addition to the ashing applications for semiconductor wafers and small substrates with photoresist, it is effective when you want to utilize processing from all directions using isotropic plasma. For mass production, please refer to the YSP650W, which processes 50 sheets at a time.

  • Wafer
  • Glass

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Single Wafer Plasma Ashing System (SWP Series)

Single Wafer Plasma Ashing System (SWP Series)

Damage-free, high throughput, multi-purpose compatible high-end devices, compound semiconductors, and MEMS. Extensive track record and comprehensive support. New type now available.

Achieved damage-less ashing using downflow plasma while eliminating charge-up damage. High throughput is realized through high-rate ashing with surface wave plasma (SWP) and an ashing chamber equipped with two rooms. In addition to ashing, the RIE chamber enables the removal of special resists and organic films, as well as the removal of hardened resists after ion implantation. It achieves both the removal of hardened resist on the surface and damage-less ashing of the underlying resist. The adoption of a compact single-wafer load lock chamber and twin-hand robots allows for a compact installation size. Proven capability to handle not only standard wafers but also special substrates such as wafers thicker than 1 mm and rectangular substrates. A versatile single-wafer etching and ashing device.

  • Ashing device
  • Etching Equipment
  • Plasma surface treatment equipment

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